The PCB Manufacturing (Fabrication) Process
We understand that the entire PCB (Printed Circuit Board) fabrication process can be overwhelming to some visitors who are new to the industry. Please direct any feedback, comments, or questions below in the comments section.
A series of steps are involved in the PCB fabrication process. For starters, it is important to understand 
that printed circuit boards (PCB) are electronic components that are produced on a nonconductive board. There are conductive connections between the electronic circuits, and they are created by using both subtractive and additive methods.
Conductive circuits can be made from nickel, chrome, and aluminum, but they are most often made of copper. PCBs usually come in three main types: multi-layered, double-sided, and single-sided. The type of board is determined by the spatial and density requirements. PCBs are routinely used in computers, machines, and even devices used for home entertainment.
The PCB fabrication process involves the following steps:
- Inner Layer Processing
- Mass Lamination
- Drilling and Cleaning
- Copper Plating
- Outer Layer Processing / Image Transfer
- Surface Finish
- Final Fabrication
The PCB fabrication process by step consists of:
- Inner Layer Processing. Beginning with a sheet of plastic, the PCB receives the circuit pattern. In this step of the process, the PCB is treated to maximize adhesion.
- Mass Lamination. In this stage of the process, the board receives a thin copper foil lamination through the use of melted copper rods. It will go through a series of brown oxide, pre-lay-up, pinning, and lay-up, before going to lamination.
- Drilling and Cleaning. Using automatic drilling machines, holes are drilled into the board. The drill
bits used for this drilling process are typically made from tungsten carbide. The holes serve as a way to mount electronic components onto the PCB, as well as providing a conductive circuit from layer to layer. After the drilling process, the PCB is often scrubbed to remove any remaining particles from the drilling. - Copper Plating. After receiving a high-pressure rinse, the PCB is given an alkali bath to improve adhesion. From there, the surface is cleaned as a way to expose the copper surface.
- Outer Layer Processing / Image Transfer. Once the copper plating has been finished, there is an etching process whereby the exposed copper is removed, exposing the pattern of the circuit board. This process typically uses an ammonia-based etching solution, or sometimes a sulfuric acid/hydrogen peroxide etching solution.
- Surface Finish. The PCB is surface finished with the use of UV energy, which will prompt the “cure” phase to the exposed image. Once the cure has been completed, the film will be stripped away. At this point, a solder mask process, as well as a silk screen process, provides the finishing touches. The solder resist process adds a coating that will help prevent short circuiting.
- Final Fabrication. During the final fabrication phase, the board receives a chemical bath, which will help to protect it from oxidation. Then it is immersed in organic silver to further protect it and prevent oxidation.
Quality Control
Throughout the process, and again when the final fabrication has been completed, the PCB undergoes a series of quality control tests. They are tested using a variety of probes and flying grid testers. Industrial CT scanning is another form of testing that is sometimes used, as it can generate two- and three-dimensional renderings of the board.
Once the PCB has completed the fabrication process and passed quality control, it is often sprayed with a protective coating or placed into anti static bags.
Please call the experts at (888) 906-6331 or Complete the Easy 1 Step PCB Quote form to submit your Circuit Board specifications.